CMP Module Process Engineer IV – Applied Materials – Phoenix, Arizona

Company Overview:

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display.

Job Description:

Serve as a technical expert to troubleshoot, optimize, and solve complex Chemical Mechanical Planarization (CMP) process, yield, and integration problems for customer fabs.

🔹 Key Responsibilities:

• Provide technical expertise as a specialist in CMP Unit Processes and Wafer Fab operations.
• Perform data analytics to identify, troubleshoot, and solve complex process and yield problems.
• Lead discussions with customers to understand High Value Problems and implement Continuous Improvement Projects.
• Increase value through defect, variability, and Cost of Ownership (COO) reduction.
• Mentor and lead junior level Module Process Engineers.

🔹 Requirements:

• Bachelor of Science degree in Engineering.
• 10+ years of direct experience in Chemical Mechanical Planarization (CMP) Process.
• Strong Wafer Fab and equipment operational background.
• Advanced data analytics skills for root cause analysis and yield enhancement.
• Ability to travel up to 20% of the time.

What The Role Offers:

• Competitive salary range from $116,000 to $159,500 per year.
• Supportive global work culture encouraging professional learning and career growth.
• Comprehensive health, wellness, and personal development programs.